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DCH UV Series
0.5-5W

Standard UV Laser

DCH-355-0.5 | DCH-355-1 | DCH-355-3 | DCH-355-5

Features

  • 355 nm wavelength
  • Power: 0.5W* to 5W*
  • Air-cooled design, water cooled option
  • All-in-one (AIO) single box design for 0.5 & 1W model
  • Patented intracavity UV generation
  • Compact, rugged, monolithic laser head
  • Total pulse control
  • TEM00 beam with typical M² < 1.2
  • Pulse rates from 1Hz to 300kHz
  • RS232 computer control
  • Field replaceable pump diodes

*For higher power UV models please see the DSH UV Series.

OUTPUT CHARACTERISTICS
ModelDCH-355-0.5 DCH-355-1 DCH-355-3 DCH-355-5
Wavelength 355 nm
Average Power @ 40 kHz 500 mW 1 W 3 W 5 W
Recommended Power Range 50% - 100%
Pulse Energy (μJ) @ 40 kHz ~12.5 ~25 ~75 ~125
Pulse Width (ns) @ 40 kHz ~15
Repetition Rate Single Shot to 200 kHz (Option to 300kHz)
Pulse to Pulse Stability < 3% rms
Polarization Ratio Horizontal; 100:1
4σ Beam Diameter @ exit ~0.3 mm ~0.3 mm ~0.4 mm~0.45 mm
Beam Divergence (Full Angle Far Field) < 3 mrad < 3 mrad < 2.5 mrad < 2.5 mrad
Beam Circularity at exit >85%
Spatial Mode TEM00 M²<1.2
Beam Pointing Stability < 25 μrad
Beam Position Accuracy < 2.5 mm and < 1° from nominal
Long Term Stability (8 hr ± 1° C) <3% rms
Line Frequency50 to 60 Hz
ENVIRONMENTAL AND UTILITY REQUIREMENTS
ModelDCH-355-0.5DCH-355-1DCH-355-3DCH-355-5
Electrical Requirement100 to 240V AC
Relative HumidityNon-condensing, 90% Max
Warm Up Time< 5 min from standby or cold start
Maximum Heat Load (laser head)~50 W~100 W
Ambient Temperature15°C to 35°C (59° to 95°F) Operating Range
InterfaceEthernet / RS 232 / GUI / External TTL Triggering
DIMENSIONS
ModelDCH-355-0.5 DCH-355-1 DCH-355-3 DCH-355-5
Dimensions* Laser Head4 in x 2.75 in x 8.1 in 4 in x 2.5 in x 7.78 in
(W x H x L) Controller None12 in x 3.5 in x 8.5 in
Weight Laser Head~6 lbs ~6.5 lbs
Weight ControllerNone10 lbs
Umbilical Length None1.5 m

*Dimensions given are without heatsinks. Air cooled or water cooled heatsink options are available (see dimensional drawings)

  • Laser Trimming of Embedded Passives
  • Glass Marking
  • Laser Direct ITO/TCO Patterning
  • LED and Medical Package Marking
  • Solar P1 to P3  Processing
  • Thin-Film Scribing
  • Rapid Prototyping/ Stereolithography
  • PCB Drilling and Structuring
  • Marking of Plastic
  • Cutting Metals
  • Thing Film Annealing

Please contact us for more options