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DSH-LP UV Series
15-25W

Long Pulse UV Laser

DSH-355-LP | DSH-355-HLP*

Features

  • Long pulse width – up to 280ns @ 200kHz
  • Power up to 25W
  • Patented intracavity UV generation
  • Compact, rugged, monolithic all-in-one industrial grade ns laser
  • Total pulse control
  • TEM00 beam with roundness >90%, typically >95%
  • Pulse rates from single shot to 200 kHz

* DSH-355-HLP is a non-standard product, please contact us for specs

OUTPUT CHARACTERISTICS

ModelDSH-355-LP
Wavelength (nm) 355
Average Power (W) 16W @ 40kHz
Average Power (W) 4.5 W @ 200 kHz
Pulse Width @ 40 kHz ~ 80 ns
Pulse Width @ 200 kHz ~280 ns
Repetition Rate Single Shot to 200 kHz
Polarization Ratio Horizontal; 100:1
Beam Diameter (at exit)~ 0.8 mm
Beam Divergence ~ 1.7 mrad
Beam Circularity > 90% @ 40 kHz
Spatial Mode TEM00 M2 < 1.3
Beam Pointing Stability < 25 μrad
Long Term Stability (8 hr ±1o C) ±2% rms
InterfaceEthernet / RS 232 / GUI / External TTL Triggering
Line Frequency 50 to 60 Hz
Relative Humidity Non-condensing, 90% Max
Electrical Requirement100 to 240 V
Dimensions Laser Head (W x H x L) 7.5 in x 3.75* in x 31 in
Ambient Temperature 15°C to 35°C (59° to 95°F) Operating Range

** Higher powers up to 25 W available upon request
† Lower rep rates (<20kHz) performance achieved by pulse energy capping

ENVIRONMENTAL AND UTILITY REQUIREMENTS
ModelDSH-355-LP
Electrical Requirement100 to 240 V
Relative HumidityNon-condensing, 90% Max
Ambient Temperature15°C to 35°C (59° to 95°F) Operating Range
InterfaceEthernet / RS 232 / GUI / External TTL Triggering
DIMENSIONS
ModelDSH-355-LP
Dimensions Laser Head (W x H x L) 7.5 in x 3.75* in x 31 in

* Does not include height of desiccant (0.35’’) and height of removable feet

  • Laser based wafer singulation
    • Full-cut wafer dicing
    • Low-k dielectric grooving
  • Wafer scribing
  • PCB and flexboard cutting and drilling
  • Micromachining of diamond, silicon, sapphire, ceramic, and metal
  • Via Hole Drilling

Please contact us for more options